Press Release
MIcable® Invited to Present at Extreme RF Global Microwave Component Technology Summit, Sharing Cutting-Edge Achievements in Wideband High-Power Couplers
Release time:2026-04-27 Author:MIcable Browse times:316



The Extreme RF Global Microwave Device Technology Summit, hosted by Microwave Journal, was successfully held online on April 22, 2026, from 10:00 to 13:15 PT (April 23, 2026, 01:00 to 04:15 Beijing time).

Wei Liu, President of MIcable®, shared the keynote stage with four international industry authorities-Pat Hindle (Media Director, Microwave Journal), Giampiero Esposito (Business Development & Product Line Manager, Maury Microwave), Patrick Melehan (Applications Engineer, Teledyne Storm Microwave) and James F. Salzman (Senior Chief Technology Officer, Teledyne HiRel Semiconductors).

The summit focused on cutting-edge RF and microwave technologies, with in-depth discussions on the application of artificial intelligence in RF/microwave product design, simulation, and system optimization. Mr. Wei Liu delivered a technical presentation titled "Wide & Ultra-Wideband High Power Directional and Dual Directional Couplers and Their Enabled Applications," providing a comprehensive overview of MICable®'s proprietary R&D achievements and innovative application practices in the field of wideband high-power couplers.


 


High-power wideband couplers are core components in high-power RF systems, enabling efficient signal transmission and precise power monitoring. They are widely used in critical sectors including communication base stations, test & measurement, broadcasting, radar, and satellite applications. These components must not only meet fundamental performance requirements such as low insertion loss and high isolation, but also overcome significant technical challenges, including broadband consistency, high-power handling, effective thermal management, and high-temperature stability — all demanding stringent process control and precision manufacturing. Through continuous optimization of circuit architecture and reliability-focused design, MICable® has developed a comprehensive product portfolio of directional and dual-directional couplers covering the 0.3–18 GHz frequency range, with continuous wave (CW) power handling up to 600 W and coupling values from 30 to 50 dB. The product series features air-dielectric stripline and coaxial structures, manufactured through precision machining and rigorous Environmental Stress Screening (ESS), ensuring stable electrical performance and long-term reliability across a wide temperature range (–55°C to +125°C) and under high-power conditions. These products are well-suited for high-power test & measurement systems, communication equipment, instrumentation, solid-state power amplifiers, and transmitters. 

Following the presentation, Mr. Wei Liu participated in a one-hour live Q&A session, engaging in in-depth exchanges with RF and microwave experts from around the world. Drawing on MICable®'s full line of high-performance RF component solutions, he explored with global peers the diverse application scenarios and technical implementation pathways for wideband high-power couplers.



The summit featured four 30-minute technical presentations paired with panel discussions, which collectively explored versatile AI applications in RF and microwave R&D — spanning MMIC simulation modeling, design automation, real-time operational parameter tuning, as well as optimal communication system algorithms and channel selection, revealing promising prospects for AI adoption across the RF landscape.Other presentations included,
⚫ High-Power Solutions for Tomorrow's Extreme RF Challenges: Upcoming 50 GHz EMC Demands--Giampiero Esposito (Maury Microwave)
⚫ Precision Under Extremes: Interconnect Technologies for High Reliability RF Systems--Patrick Melehan (Teledyne Storm Microwave)
⚫ The Effects of Hydrogen Intoxication in Hermetic, Non-Hermetic, Space, and Non-Space RF Applications--James F. Salzman (Teledyne HiRel Semiconductors) 

The summit provided a premier platform for global industry professionals to exchange knowledge and explore innovative pathways in product development. A full replay of the summit is available at:
https://www.bigmarker.com/horizon-house-publications/rf-microwave-summit-extreme-rf?utm_bmcr_source=Mic
 
*Meet Us at IMS 2026*

MIcable® will also be exhibiting its full range of high-performance RF components and solutions at IMS 2026(International Microwave Symposium), taking place June 9–11, 2026 in Boston, USA — Booth #12023. We look forward to connecting with industry peers, exploring the frontiers of technology together, and sharing in this premier industry event.




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E-mail:sales@micable.cn